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We are pleased to announce that our fashion CAD software "CREACOMPO®Ⅱ" and tech pack software "XIFORM®" will be exhibited at "the 55th ASM OSAKA (Apparel & Sewing Machine promotion 2026)" from March 6 to Marh 7 at the INTEX OSAKA in Osaka, Japan.
Please register in advance via the booking form (in Japanese): https://www.toray-acs.co.jp/resources/hands-on-contact/
Venue: Booth No. 32, Building 3 of the INTEX OSAKA (Suminoe, Osaka, Japan)
We would be grateful if you could share this with your overseas business contacts.
We look forward to seeing you at the exhibition.